京瓷宣布高刚性多层陶瓷芯基板：可有效应对先进封装中翘曲问题
IT之家 4 月 28 日消息，京瓷 (KYOCERA) 当地时间 27 日宣布，其成功开发出一款具备高刚性的多层陶瓷芯基板，正在推动该材料的材料商业化。 该基板基于京瓷专有精细陶瓷材料，专为高密度布线和卓越的刚性而设计， 可显著降低先进封装异构集成中的翘曲风险 （IT之家注：表
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