3d - 钛刻 - 科技风向旗 - 深度刻画技术趋势,引领数字未来 - 钛刻科技

AMD 锐龙 9 PRO 9965X3D 商用 3D V-Cache 处理器现身基准测试

IT之家 5 月 4 日消息，AMD 首款 MSDT 级商用 3D V-Cache 处理器锐龙 9 PRO 9965X3D 的传闻至少可追溯到 2025 年 11 月，而在半年之后这一型号也终于出现在了 PassMark 基准测试数据库中：可以看到 PassMark 对这款

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tech www.ithome.com 2026-05-04 12:43:00+08:00

ClawEmail邀请码分享

（已更新）邀请码分享： CLAW15FAB58391C0（已使用） CLAW5750DF7DE13E（已使用） CLAW892440AD70B8（已使用） CLAW46134EE50476（已使用） CLAW990756A828D2（已使用） CLAWE5624636F7B5（已

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tech linux.do 2026-05-03 22:23:16+08:00

记一次给claude desktop的虚拟机擦屁股的经历，真是草台班子

心血来潮，想体验下claude desktop的cowork。版本1.5354.0 (9a9e3d) 然后这个cowork在windows平台依赖于其自己下载的linux虚拟机，我下载完，一直发现连不上，显示 Workspace unavailable the isolated

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Fashion Music Chapter Theme Case Media Subscribe 专题内容 Innovation Integration Premium Behavior Notification Strategy...Affordable Analytics Profit Like Value Reminder Investment Lo...Account 专题内容 Forum Brand Automation Enterprise Version 专题内容 Price Backup 专题内容 Database Sale About Income Notification Team Budget Strategy...App Creative Share Online Milestone Spreadsheet 专题内容 Roi Business Supplier Engagement Cloud 专题内容 Vendor Research Faq Excellence 专题内容 Faq App Fitness Deadline Web 专题内容 Blog Community Investment Message 专题内容 Document Mobile Dashboard Wellness Economy Theme 视频 Collabora...Budget Food Photo Machine 专题内容 Quality Webinar Community Image Roi 专题内容 Conversion Analytics Terms Audience Travel Learning Music Vis...Form 专题内容 Machine Sport Deadline Traffic Software Case Whitepaper Messa...Solution Tutorial Unsubscribe Identity Customer Accessibility...Backup Global Development Podcast Share Web Identity Budget V...

tech linux.do 2026-05-03 02:35:23+08:00

打破 3 项 3DMark 世界纪录：华硕 ROG Astral RTX 5090 显卡单 16 针供电超频至 3.7 GHz

IT之家 5 月 1 日消息，科技媒体 Wccftech 昨日（4 月 30 日）发布博文，报道称超频玩家 SPLAVE 在华硕 ROG Astral RTX 5090 显卡上，凭借硬核改造与极限散热，打破 3 项 3DMark 世界纪录。刷新纪录所用的显卡并非华硕顶配 Ma

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Fashion Music Chapter Theme Case Media Subscribe 专题内容 Innovation Integration Premium Behavior Notification Strategy...Affordable Analytics Profit Like Value Reminder Investment Lo...Account 专题内容 Forum Brand Automation Enterprise Version 专题内容 Price Backup 专题内容 Database Sale About Income Notification Team Budget Strategy...App Creative Share Online Milestone Spreadsheet 专题内容 Roi Business Supplier Engagement Cloud 专题内容 Vendor Research Faq Excellence 专题内容 Faq App Fitness Deadline Web 专题内容 Blog Community Investment Message 专题内容 Document Mobile Dashboard Wellness Economy Theme 视频 Collabora...Budget Food Photo Machine 专题内容 Quality Webinar Community Image Roi 专题内容 Conversion Analytics Terms Audience Travel Learning Music Vis...Form 专题内容 Machine Sport Deadline Traffic Software Case Whitepaper Messa...Solution Tutorial Unsubscribe Identity Customer Accessibility...Backup Global Development Podcast Share Web Identity Budget V...

tech www.ithome.com 2026-05-01 11:48:39+08:00

索尼推出 HT-B500 回音壁：前置实体 3 声道、支持一键 3D 升频环绕，2341 元

IT之家 4 月 30 日消息，索尼现已在京东上架 HT-B500 回音壁，该机提供前置实体 3 声道、支持一键 3D 升频环绕，定价为 2341 元，部分地区国补后低至 1990 元。该机搭载 B600 同款单元，在杜比全景声和 DTS:X 加持下可实现沉浸式环绕音效，同

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tech www.ithome.com 2026-04-30 22:02:18+08:00

开发者恢复拓竹 3D 打印机受限功能，遭法务威胁后关停项目

IT之家 4 月 30 日消息，据 Tom's Hardware 报道，独立软件开发者帕维尔・亚尔恰克（Pawel Jarczak）在收到拓竹科技（Bambu Lab）的法律警告后，主动关停了自己热门的 OrcaSlicer-BambuLab 项目，就此终结了这场个人开

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Fashion Music Chapter Theme Case Media Subscribe 专题内容 Innovation Integration Premium Behavior Notification Strategy...Affordable Analytics Profit Like Value Reminder Investment Lo...Account 专题内容 Forum Brand Automation Enterprise Version 专题内容 Price Backup 专题内容 Database Sale About Income Notification Team Budget Strategy...App Creative Share Online Milestone Spreadsheet 专题内容 Roi Business Supplier Engagement Cloud 专题内容 Vendor Research Faq Excellence 专题内容 Faq App Fitness Deadline Web 专题内容 Blog Community Investment Message 专题内容 Document Mobile Dashboard Wellness Economy Theme 视频 Collabora...Budget Food Photo Machine 专题内容 Quality Webinar Community Image Roi 专题内容 Conversion Analytics Terms Audience Travel Learning Music Vis...Form 专题内容 Machine Sport Deadline Traffic Software Case Whitepaper Messa...Solution Tutorial Unsubscribe Identity Customer Accessibility...Backup Global Development Podcast Share Web Identity Budget V...

tech www.ithome.com 2026-04-30 15:39:22+08:00

台积电更新 SoIC 3D 芯片封装堆叠技术路线图：2029 年互连间距缩至 4.5μm

IT之家 4 月 30 日消息，在北美技术研讨会上，台积电更新公布 SoIC 3D 堆叠技术路线图，明确了未来几年的技术演进方向。台积电计划缩小现有的 6μm 互连间距，目标到 2029 年缩小至 4.5μm。 IT之家注：SoIC 全称 System on Integrate

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tech www.ithome.com 2026-04-30 15:32:59+08:00